| Date (Default Date) | Hs Code | Product Description (Based On Hs Code) | Net Weight | FOB In USD | Destination Country | Details |
|---|---|---|---|---|---|---|
| 31-01-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 10240 | 45920 | JAPAN | |
| 31-03-2019 | 84869042 | PARTS & ACESS. DIE ATTACH APPTUS TAPE AUTO, WIRE BONDERS & ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 14 | 448 | UNITED STATES | |
| 31-05-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 1200 | 141428 | CHINA | |
| 31-05-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 17000 | 1013770 | MALAYSIA | |
| 30-09-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 2520 | 3561.04 | JAPAN | |
| 30-09-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 2565 | 2100 | MALAYSIA | |
| 30-09-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 5050 | 255500 | SINGAPORE | |
| 31-10-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 6470 | 3000 | MALAYSIA | |
| 30-11-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 19500 | 155000 | MALAYSIA | |
| 31-12-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 126 | 6000 | MALAYSIA | |
| 31-12-2019 | 84864020 | DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS | 10800 | 56393.9 | SINGAPORE |