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Date (Default Date) Hs Code Product Description (Based On Hs Code) Net Weight FOB In USD Destination Country Details
31-01-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 10240 45920 JAPAN
31-03-2019 84869042 PARTS & ACESS. DIE ATTACH APPTUS TAPE AUTO, WIRE BONDERS & ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 14 448 UNITED STATES
31-05-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 1200 141428 CHINA
31-05-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 17000 1013770 MALAYSIA
30-09-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 2520 3561.04 JAPAN
30-09-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 2565 2100 MALAYSIA
30-09-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 5050 255500 SINGAPORE
31-10-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 6470 3000 MALAYSIA
30-11-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 19500 155000 MALAYSIA
31-12-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 126 6000 MALAYSIA
31-12-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 10800 56393.9 SINGAPORE


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