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Date (Default Date) Hs Code Product Description (Based On Hs Code) Net Weight CIF In USD Origin Country Details
31-01-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 99 705 CHINA
31-01-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 8604 71206 JAPAN
31-01-2019 84869042 PARTS & ACESS. DIE ATTACH APPTUS TAPE AUTO, WIRE BONDERS & ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 107 7038 SINGAPORE
28-02-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 8 223 CHINA
28-02-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 2211 17249 JAPAN
31-03-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 85 11864 JAPAN
31-05-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 4127 60807 JAPAN
31-05-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 1 1 KOREA, REPUBLIC OF
31-05-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 1 75 UKRAINE
31-05-2019 84869042 PARTS & ACESS. DIE ATTACH APPTUS TAPE AUTO, WIRE BONDERS & ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 2 175 HONG KONG
31-05-2019 84869042 PARTS & ACESS. DIE ATTACH APPTUS TAPE AUTO, WIRE BONDERS & ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 9 20446 MALAYSIA
31-08-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 4 92 CHINA
31-08-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 4331 39197 JAPAN
31-08-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 4 342 SINGAPORE
31-08-2019 84869042 PARTS & ACESS. DIE ATTACH APPTUS TAPE AUTO, WIRE BONDERS & ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 67 7218 SINGAPORE
30-09-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 962 72945 JAPAN
30-09-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 9 9600 SINGAPORE
31-10-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 4 417 AUSTRALIA
31-10-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 2975 37231 JAPAN
31-10-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 188 52460 SINGAPORE
30-11-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 2 1 CHINA
30-11-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 1000 10560 JAPAN
30-11-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 116 68197 SINGAPORE
30-11-2019 84869042 PARTS & ACESS. DIE ATTACH APPTUS TAPE AUTO, WIRE BONDERS & ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 165 20000 SINGAPORE
31-12-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 837 10799 CHINA
31-12-2019 84864020 DIE ATTACH APPARATUS, TAPE AUTOMATED, WIRE BONDERS AND ENCAPSULATION EQUIPMENT FOR THE ASSEMBLY OF SEMICONDUCTORS 2191 39264 JAPAN


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