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Date (Default Date) Hs Code Product Description (Based On Hs Code) Net Weight CIF In USD Origin Country Details
31-01-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 225404 638356 CHINA
31-01-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 2080 21276 KOREA, REPUBLIC OF
31-01-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 180 773 MALAYSIA
31-01-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 26952 253835 TAIWAN
31-01-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 267 2959 VIET NAM
31-01-2019 84659320 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS,NOT ELECTRICALLY OPERATED 4454 11104 CHINA
31-01-2019 84861050 GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 420 5172 CHINA
31-01-2019 84861050 GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 1402 11602 JAPAN
31-01-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 1685 17483 JAPAN
31-01-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 46 591 KOREA, REPUBLIC OF
31-01-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 115 991 MALAYSIA
28-02-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 213203 634671 CHINA
28-02-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 128 9105 ITALY
28-02-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 874 6466 KOREA, REPUBLIC OF
28-02-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 589 2576 MALAYSIA
28-02-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 7927 103913 TAIWAN
28-02-2019 84659320 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS,NOT ELECTRICALLY OPERATED 17414 54000 CHINA
28-02-2019 84861050 GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 98 1114 CHINA
28-02-2019 84861050 GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 1 113 JAPAN
28-02-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 50 740 CHINA
28-02-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 1035 10785 JAPAN
28-02-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 2 3560 KOREA, REPUBLIC OF
31-03-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 155650 474630 CHINA
31-03-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 169 1814 FINLAND
31-03-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 12238 30719 JAPAN
31-03-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 123 2462 KOREA, REPUBLIC OF
31-03-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 42 700 PHILIPPINES
31-03-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 20 1093 SINGAPORE
31-03-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 23513 231351 TAIWAN
31-03-2019 84659320 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS,NOT ELECTRICALLY OPERATED 19 3574 JAPAN
31-03-2019 84659320 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS,NOT ELECTRICALLY OPERATED 83 1131 UNITED KINGDOM
31-03-2019 84861050 GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 1110 70837 JAPAN
31-03-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCTOR WAFERS 85 7123 JAPAN
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 7836 12838.5 BELGIUM
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 88735 282083 CHINA
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 38209 111106 GERMANY, FED. REP. OF
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 128 1946.9 JAPAN
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 1332 17664 KOREA, REPUBLIC OF
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 16 390.591 SINGAPORE
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 14647 140869 TAIWAN
30-04-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 2516 25128 VIET NAM
30-04-2019 84659320 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 4194 12028 CHINA
30-04-2019 84659320 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SI 1 12.961 UNITED KINGDOM
30-04-2019 84861050 GRINDING, POLISHING AND LAPPING MACHINES FOR PROCESSING OF SEMICONDUCT 673 22089.5 JAPAN
30-04-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR 297 15775.4 JAPAN
30-04-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR 5 9780 KOREA, REPUBLIC OF
30-04-2019 84869016 PARTS AND ACCESSORIES OF GRINDING, POLISHING AND LAPPING MACHINES FOR 3 5385 MALAYSIA
31-05-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 127106 511042 CHINA
31-05-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 3200 103496 ITALY
31-05-2019 84659310 GRINDING, SANDING OR POLISHING MACHINES, FOR WORKING WOODCORK, BONE/SIMILAR HARD MATERIALS, ELECTRICALLY OPERATED 2398 170493 JAPAN


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