| Date (Default Date) | Hs Code | Product Description (Based On Hs Code) | Net Weight | CIF In USD | Origin Country | Details |
|---|---|---|---|---|---|---|
| 31-01-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 592 | 24474 | THAILAND | |
| 31-01-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 61 | 1605 | UNITED STATES | |
| 28-02-2019 | 84861040 | MACHINES FOR WORKING BY REMOVAL OF MATERIAL, BY LASER/OTHERLIGHT/PHOTON BEAM IN THE PRODUCTION OF SEMICONDUCTOR WAFERS | 5050 | 74665 | CHINA | |
| 28-02-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 50 | 15345 | ITALY | |
| 28-02-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 162 | 3033 | UNITED STATES | |
| 31-03-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 261 | 17147 | SINGAPORE | |
| 30-04-2019 | 84861040 | MACHINES FOR WORKING BY REMOVAL OF MATERIAL, BY LASER/OTHERLIGHT/PHOTO | 3091 | 13190 | CHINA | |
| 30-04-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT | 17 | 150 | AUSTRALIA | |
| 30-04-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT | 4 | 2500 | CHINA | |
| 30-06-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT | 60 | 1280 | UNITED STATES | |
| 30-11-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 2 | 1581 | FRANCE | |
| 30-11-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 15 | 1384 | THAILAND | |
| 30-11-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 238 | 5564 | UNITED STATES | |
| 31-12-2019 | 84861040 | MACHINES FOR WORKING BY REMOVAL OF MATERIAL, BY LASER/OTHERLIGHT/PHOTON BEAM IN THE PRODUCTION OF SEMICONDUCTOR WAFERS | 1 | 40 | CHINA | |
| 31-12-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 33 | 1248 | UNITED STATES |
Loading ....