| Date (Default Date) | Hs Code | Product Description (Based On Hs Code) | Net Weight | FOB In USD | Destination Country | Details |
|---|---|---|---|---|---|---|
| 31-01-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 0 | 0 | SINGAPORE | |
| 28-02-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 50 | 11878 | SINGAPORE | |
| 28-02-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 100 | 170 | AUSTRALIA | |
| 31-03-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 1 | 536 | SINGAPORE | |
| 31-05-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 805 | 49316.6 | AUSTRIA | |
| 31-05-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 479 | 164564 | SINGAPORE | |
| 31-05-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 100 | 150 | AUSTRALIA | |
| 31-05-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 230 | 7035 | THAILAND | |
| 31-08-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 21 | 8009.13 | SINGAPORE | |
| 30-09-2019 | 84869013 | PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS | 5.5 | 216.937 | CHINA | |
| 31-10-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 1594 | 400 | MALAYSIA | |
| 31-10-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 0.06 | 1.459 | SINGAPORE | |
| 30-11-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 2 | 14395.7 | SINGAPORE | |
| 31-12-2019 | 84862099 | OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM | 10.5 | 81.038 | SINGAPORE |
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