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Date (Default Date) Hs Code Product Description (Based On Hs Code) Net Weight CIF In USD Origin Country Details
31-01-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 84 882 CHINA
31-01-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 1317 26898 HONG KONG
31-01-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 33 730 KOREA, REPUBLIC OF
31-01-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 400 23082 SINGAPORE
31-01-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 1408 18520 CHINA
31-01-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 275 19711 SINGAPORE
31-01-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 592 24474 THAILAND
31-01-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 61 1605 UNITED STATES
28-02-2019 84861040 MACHINES FOR WORKING BY REMOVAL OF MATERIAL, BY LASER/OTHERLIGHT/PHOTON BEAM IN THE PRODUCTION OF SEMICONDUCTOR WAFERS 5050 74665 CHINA
28-02-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 8 818 KOREA, REPUBLIC OF
28-02-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 1 125 UNITED STATES
28-02-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 50 15345 ITALY
28-02-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 162 3033 UNITED STATES
31-03-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 1104 20390 CHINA
31-03-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 2 840 JAPAN
31-03-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 66 805 SINGAPORE
31-03-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 1327 15012 CHINA
31-03-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 260 74520 SINGAPORE
31-03-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 261 17147 SINGAPORE
31-05-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 32 540 CHINA
31-08-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 3 20 CHINA
31-08-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 6 1550 SINGAPORE
31-08-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 322 17178 SINGAPORE
30-09-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 1581 24950 HONG KONG
30-09-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 5 145 ITALY
30-09-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 1570 21666 CHINA
30-09-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 741 73711 SINGAPORE
31-10-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 1 232 SINGAPORE
31-10-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 2 100 CHINA
30-11-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 40 2382 KOREA, REPUBLIC OF
30-11-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 2 63 UNITED STATES
30-11-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 61 1300 CHINA
30-11-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 6893 342205 SINGAPORE
30-11-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 2 1581 FRANCE
30-11-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 15 1384 THAILAND
30-11-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 238 5564 UNITED STATES
31-12-2019 84861040 MACHINES FOR WORKING BY REMOVAL OF MATERIAL, BY LASER/OTHERLIGHT/PHOTON BEAM IN THE PRODUCTION OF SEMICONDUCTOR WAFERS 1 40 CHINA
31-12-2019 84862091 LASERCUTTERS FOR CUTTING CONTACTING TRACKS IN SEMICONDUCTOR PRODUCTION BY LASER BEAM 54 882 MALAYSIA
31-12-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 2 46 HONG KONG
31-12-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 3 3794 JAPAN
31-12-2019 84862099 OTHER LASERCUTTERS FOR CUTTING CONTACTING TRACKS INSEMICONDUCTOR PRODUCTION BY LASER BEAM 3 389 SINGAPORE
31-12-2019 84869013 PARTS & ACCES OF MACHINES FOR REMOVAL OF MATERIAL,BY LASER/OTHER LIGHT/PHOTON BEAM IN THE PROD. OF SMCONDUCTOR WAFERS 33 1248 UNITED STATES


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